Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11024595 | Thermocompression bond tips and related apparatus and methods | Brandon P. Wirz, Zhaohui Ma | 2021-06-01 | $25,615,000 |
| 10998208 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Jeremy E. Minnich, Travis M. Jensen | 2021-05-04 | $18,454,000 |
| 10950568 | Semiconductor device assembly with surface-mount die support structures | Brandon P. Wirz | 2021-03-16 | $22,312,000 |
| 10952333 | Method for stress reduction in semiconductor package via carrier | Xiao Li | 2021-03-16 | $22,312,000 |