Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189590 | Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies | Andrew M. Bayless | 2021-11-30 |
| 11189609 | Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices | Andrew M. Bayless | 2021-11-30 |
| 11024595 | Thermocompression bond tips and related apparatus and methods | Benjamin L. McClain, Zhaohui Ma | 2021-06-01 |
| 11004828 | Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices | Bradley R. Bitz, Pei Sian Shao | 2021-05-11 |
| 10950568 | Semiconductor device assembly with surface-mount die support structures | Benjamin L. McClain | 2021-03-16 |
| 10923447 | Semiconductor device assembly with die support structures | David R. Hembree | 2021-02-16 |