Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195740 | Methods and apparatus for wafer handling and processing | Kyle K. Kirby | 2021-12-07 |
| 11189590 | Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies | Brandon P. Wirz | 2021-11-30 |
| 11189609 | Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices | Brandon P. Wirz | 2021-11-30 |
| 10971471 | Methods and systems for manufacturing semiconductor devices | Cassie L. Bayless | 2021-04-06 |