Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004828 | Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices | Brandon P. Wirz, Bradley R. Bitz | 2021-05-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004828 | Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices | Brandon P. Wirz, Bradley R. Bitz | 2021-05-11 |