Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024595 | Thermocompression bond tips and related apparatus and methods | Benjamin L. McClain, Brandon P. Wirz | 2021-06-01 |
| 10923448 | Bond pad with micro-protrusions for direct metallic bonding | Aibin Yu, Wei Zhou | 2021-02-16 |