Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923448 | Bond pad with micro-protrusions for direct metallic bonding | Wei Zhou, Zhaohui Ma | 2021-02-16 |
AY
Aibin Yu
Overall (2021): #542,847 of 548,734Top 100%
1
Patents 2021