Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139258 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2021-10-05 |
| 11081458 | Methods and apparatuses for reflowing conductive elements of semiconductor devices | — | 2021-08-03 |