Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121101 | Flip chip packaging rework | Charles L. Arvin, Karen P. McLaughlin, Thomas A. Wassick | 2021-09-14 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Charles L. Arvin, Sylvain Pharand, Bhupender Singh | 2021-05-11 |
| 10957650 | Bridge support structure | Charles L. Arvin, Karen P. McLaughlin, Thomas Weiss | 2021-03-23 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer, Shidong Li | 2021-02-09 |
| 10892249 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Charles L. Reynolds, Thomas Weiss | 2021-01-12 |