Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11171114 | Die stack with cascade and vertical connections | Min-Tih Lai, Florence R. Pon, Yuhong Cai | 2021-11-09 | $28,241,000 |
| 11145632 | High density die package configuration on system boards | Juan E. Dominguez, Hyoung Il Kim, Bilal Khalaf | 2021-10-12 | $32,982,000 |
| 10964682 | Data storage system using wafer-level packaging | Leo Craft | 2021-03-30 | $32,599,000 |
| 10910347 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, Zhicheng Ding, Richard Patten | 2021-02-02 | $28,243,000 |