{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2021", "item": "https://www.patentleaderboard.com/2021/"}, {"@type": "ListItem", "position": 3, "name": "Intel", "item": "https://www.patentleaderboard.com/2021/company/intel"}, {"@type": "ListItem", "position": 4, "name": "Yuhong Cai", "item": "https://www.patentleaderboard.com/2021/inventor/fl:yu_ln:cai-40"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
YC

Yuhong Cai — 1 Patent in 2021

Intel: 1 patents #1,968 of 5,160Top 40%
Folsom, CA: #130 of 277 inventorsTop 50%
California: #26,007 of 66,859 inventorsTop 40%
Overall (2021): #196,585 of 548,734Top 40%
1 Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11171114 Die stack with cascade and vertical connections Min-Tih Lai, Florence R. Pon, John G. Meyers 2021-11-09 $28,241,000