Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11145632 | High density die package configuration on system boards | Hyoung Il Kim, Bilal Khalaf, John G. Meyers | 2021-10-12 | $32,982,000 |
JD
Juan E. Dominguez — 1 Patent in 2021
Overall (2021): #389,143 of 548,734Top 75%
1
Patents 2021