Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145632 | High density die package configuration on system boards | Juan E. Dominguez, Hyoung Il Kim, John G. Meyers | 2021-10-12 |
| 11064612 | Buried electrical debug access port | Florence R. Pon, Saeed S. Shojaie | 2021-07-13 |