Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211314 | Interposer for electrically connecting stacked integrated circuit device packages | Yi Xu | 2021-12-28 |
| 11145632 | High density die package configuration on system boards | Juan E. Dominguez, Bilal Khalaf, John G. Meyers | 2021-10-12 |
| 10892248 | Multi-stacked die package with flexible interconnect | — | 2021-01-12 |