Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11211314 | Interposer for electrically connecting stacked integrated circuit device packages | Hyoung Il Kim | 2021-12-28 | $27,770,000 |
| 11056465 | Semiconductor package having singular wire bond on bonding pads | — | 2021-07-06 | $31,309,000 |