Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10910347 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Zhicheng Ding | 2021-02-02 | $28,243,000 |
RP
Richard Patten — 1 Patent in 2021
Overall (2021): #288,453 of 548,734Top 55%
1
Patents 2021