Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11148044 | Input device for intelligent terminal | Haitao Duan, Peng Li | 2021-10-19 |
| 11101254 | Flip-chip like integrated passive prepackage for SIP device | Bin Liu | 2021-08-24 |
| 11081451 | Die stack with reduced warpage | Yong She, Bin Liu, Aiping Tan | 2021-08-03 |
| 10991679 | Stair-stacked dice device in a system in package, and methods of making same | Bin Liu, Yong She, Aiping Tan, Li Deng | 2021-04-27 |
| 10930622 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Bin Liu, Yong She, Aiping Tan, Li Deng | 2021-02-23 |
| 10910347 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Richard Patten | 2021-02-02 |