Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10991679 | Stair-stacked dice device in a system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Aiping Tan | 2021-04-27 | $44,593,000 |
| 10930622 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Aiping Tan | 2021-02-23 | $31,062,000 |