Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11081451 | Die stack with reduced warpage | Yong She, Bin Liu, Zhicheng Ding | 2021-08-03 | $25,424,000 |
| 10991679 | Stair-stacked dice device in a system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Li Deng | 2021-04-27 | $44,593,000 |
| 10971478 | Interposer design in package structures for wire bonding applications | — | 2021-04-06 | $36,336,000 |
| 10930622 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Zhicheng Ding, Bin Liu, Yong She, Li Deng | 2021-02-23 | $31,062,000 |