Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11114606 | MRAM devices containing a harden gap fill dielectric material | Alexander Reznicek, Oleg Gluschenkov, Yasir Sulehria | 2021-09-07 | $7,685,000 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo +3 more | 2021-04-13 | $3,936,000 |