Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11205592 | Self-aligned top via structure | Ruilong Xie, Chih-Chao Yang, Kangguo Cheng | 2021-12-21 | $5,237,000 |
| 10916650 | Uniform bottom spacer for VFET devices | Steven R. Bentley, Chanro Park, Ruilong Xie, Tenko Yamashita | 2021-02-09 | $3,536,000 |