Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133155 | Apparatus for depositing metal films with plasma treatment | Daping Yao, Hyman Lam, John C. Forster, Jiang Lu, Can Xu +2 more | 2021-09-28 |
| 10982326 | Counter-flow multi inject for atomic layer deposition chamber | Paul F. Ma, Guodan Wei, Chun-Teh Kao | 2021-04-20 |