Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2020-07-28 |
| 10727218 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Wen-De Wang | 2020-07-28 |