Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2020-07-28 |
| 10658409 | Semiconductor structure and method of manufacturing the same | Sheng-Chan Li, Tzu-Hsiang Chen, Yu-Jen Wang, Yen-Ting Chiang, Cheng-Hsien Chou +1 more | 2020-05-19 |
| 10541297 | Semiconductor structure having integrated inductor therein | Ming-Che Lee, Sheng-Chau Chen, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2020-01-21 |