Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2020-09-22 |
DK
Darryl Kuo
Overall (2020): #499,902 of 565,922Top 90%
1
Patents 2020