Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861788 | Patterning approach for improved via landing profile | Chung-Wen Wu | 2020-12-08 |
| 10770345 | Integrated circuit and fabrication method thereof | Tai-Yen Peng, Chang-Sheng Lin, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang +3 more | 2020-09-08 |
| 10755974 | Interconnect structure and method of forming same | Ming-Hui Chu, Jyu-Horng Shieh | 2020-08-25 |
| 10714383 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Jyu-Horng Shieh, Minghsing Tsai | 2020-07-14 |
| 10679895 | Interconnect structure and method of forming the same | Jeng-Shiou Chen | 2020-06-09 |
| 10658184 | Pattern fidelity enhancement with directional patterning technology | Yu-Tien Shen, Chi-Cheng Hung, Chin-Hsiang Lin, Chien-Wei Wang, Ching-Yu Chang +7 more | 2020-05-19 |
| 10651373 | Memory device and fabrication method thereof | Tai-Yen Peng, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang +3 more | 2020-05-12 |
| 10535556 | Integrated circuit with conductive line having line-ends | Jyu-Horng Shieh, Pei-Wen Huang | 2020-01-14 |