Issued Patents 2020
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10876977 | Inspection management system, inspection management apparatuses, and inspection management method | Katsuki Nakajima, Mayuko Tanaka, Takako Onishi, Isao Nakanishi | 2020-12-29 |
| 10851776 | Sliding member and sliding machine | Masaru Okuyama, Mamoru Tohyama, Noriyuki Emoto, Naohito Yoshida | 2020-12-01 |
| 10840202 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Yasumitsu Orii | 2020-11-17 |
| 10833035 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Yasumitsu Orii | 2020-11-10 |
| 10797011 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Yasumitsu Orii | 2020-10-06 |
| 10693451 | Ringing suppressor circuit | Youhei SEKIYA, Tomohisa Kishigami | 2020-06-23 |
| 10643910 | Fabrication of a sacrificial interposer test structure | Keishi Okamoto | 2020-05-05 |
| 10637105 | Battery embedded architecture for supplying appropriate voltage | Keiji Matsumoto | 2020-04-28 |
| 10622311 | High-density interconnecting adhesive tape | Akihiro Horibe, Keishi Okamoto | 2020-04-14 |
| 10601453 | Electronic control unit | Youhei SEKIYA, Tomohisa Kishigami | 2020-03-24 |
| 10595399 | Method of reducing warpage of an organic substrate | Sayuri Hada, Keishi Okamoto | 2020-03-17 |
| 10542651 | Inspection apparatus and quality control system for surface mounting line | Mayuko Kishimoto, Shimpei Fujii, Katsuki Nakajima | 2020-01-21 |
| 10529665 | High-density interconnecting adhesive tape | Akihiro Horibe, Keishi Okamoto | 2020-01-07 |