Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840202 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2020-11-17 |
| 10833035 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2020-11-10 |
| 10797011 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2020-10-06 |