Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840202 | Method of forming solder bumps | Toyohiro Aoki, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2020-11-17 |
| 10833035 | Method of forming solder bumps | Toyohiro Aoki, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2020-11-10 |
| 10797011 | Method of forming solder bumps | Toyohiro Aoki, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2020-10-06 |
| 10741514 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Eiji Nakamura | 2020-08-11 |
| 10692829 | Method of forming a solder bump structure | Toyohiro Aoki, Eiji Nakamura | 2020-06-23 |
| 10615143 | Injection molded solder bumping | Toyohiro Aoki, Eiji Nakamura, Kuniaki Sueoka | 2020-04-07 |
| 10613282 | Fluid control structure | Elaine Cyr, Paul F. Fortier, Patrick Jacques, Koji Masuda, Masao Tokunari | 2020-04-07 |
| 10607956 | Method of forming a solder bump structure | Toyohiro Aoki, Eiji Nakamura | 2020-03-31 |
| 10598874 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Eiji Nakamura, Masao Tokunari | 2020-03-24 |
| 10593616 | Reduction of stress in via structure | Toyohiro Aoki, Akihiro Horibe, Sayuri Hada, Eiji Nakamura, Kuniaki Sueoka | 2020-03-17 |
| 10566302 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Eiji Nakamura | 2020-02-18 |
| 10553553 | Method of forming a solder bump structure | Toyohiro Aoki, Eiji Nakamura | 2020-02-04 |