Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679912 | Wafer scale testing and initialization of small die chips | Akihiro Horibe, Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian | 2020-06-09 |
| 10679916 | Circuit module and manufacturing method thereof | Akihiro Horibe, Sayuri Hada | 2020-06-09 |
| 10672638 | Picking up irregular semiconductor chips | Akihiro Horibe | 2020-06-02 |
| 10615143 | Injection molded solder bumping | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura | 2020-04-07 |
| 10593616 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Akihiro Horibe, Sayuri Hada, Eiji Nakamura | 2020-03-17 |