Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679912 | Wafer scale testing and initialization of small die chips | Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian, Kuniaki Sueoka | 2020-06-09 |
| 10679916 | Circuit module and manufacturing method thereof | Sayuri Hada, Kuniaki Sueoka | 2020-06-09 |
| 10672638 | Picking up irregular semiconductor chips | Kuniaki Sueoka | 2020-06-02 |
| 10622311 | High-density interconnecting adhesive tape | Hiroyuki Mori, Keishi Okamoto | 2020-04-14 |
| 10593616 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Sayuri Hada, Eiji Nakamura, Kuniaki Sueoka | 2020-03-17 |
| 10529665 | High-density interconnecting adhesive tape | Hiroyuki Mori, Keishi Okamoto | 2020-01-07 |