Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643910 | Fabrication of a sacrificial interposer test structure | Hiroyuki Mori | 2020-05-05 |
| 10622311 | High-density interconnecting adhesive tape | Akihiro Horibe, Hiroyuki Mori | 2020-04-14 |
| 10595399 | Method of reducing warpage of an organic substrate | Sayuri Hada, Hiroyuki Mori | 2020-03-17 |
| 10529665 | High-density interconnecting adhesive tape | Akihiro Horibe, Hiroyuki Mori | 2020-01-07 |