Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804181 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Marcus E. Interrante, Shidong Li, Tuhin Sinha | 2020-10-13 |
| 10636746 | Method of forming an electronic package | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li | 2020-04-28 |
| 10607928 | Reduction of laminate failure in integrated circuit (IC) device carrier | Anson J. Call, Shidong Li, Brian W. Quinlan, Kamal K. Sikka, Rui Wang | 2020-03-31 |
| 10593564 | Lid attach optimization to limit electronic package warpage | Shidong Li, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2020-03-17 |