Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679916 | Circuit module and manufacturing method thereof | Akihiro Horibe, Kuniaki Sueoka | 2020-06-09 |
| 10593616 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Akihiro Horibe, Eiji Nakamura, Kuniaki Sueoka | 2020-03-17 |
| 10595399 | Method of reducing warpage of an organic substrate | Hiroyuki Mori, Keishi Okamoto | 2020-03-17 |