Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867897 | PoP device | Chin-Chuan Chang, Jing-Cheng Lin, Wan-Ting Shih | 2020-12-15 |
| 10784211 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng | 2020-09-22 |
| 10741511 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Jing-Cheng Lin, Cheng-Lin Huang | 2020-08-11 |
| 10692789 | Stacked fan-out package structure | Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2020-06-23 |