Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854590 | Semiconductor die package with more than one hanging die | Sven Albers, Richard Patten, Georg Seidemann, Christian Geissler | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2020-10-27 |
| 10741486 | Electronic components having three-dimensional capacitors in a metallization stack | Sven Albers, Christian Geissler | 2020-08-11 |
| 10714455 | Integrated circuit package assemblies including a chip recess | Georg Seidemann | 2020-07-14 |
| 10680147 | Method of producing a lighting device | Peter Nagel | 2020-06-09 |
| 10672731 | Wafer level package structure with internal conductive layer | Sven Albers, Georg Seidemann, Christian Geissler, Richard Patten | 2020-06-02 |
| 10651102 | Interposer with conductive routing exposed on sidewalls | Christian Geissler, Georg Seidemann, Sonja Koller | 2020-05-12 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2020-02-04 |