| 10797039 |
Semiconductor device and method of forming a 3D interposer system-in-package module |
DeokKyung Yang, OhHan Kim, HunTeak Lee, InSang Yoon, Il Kwon Shim |
2020-10-06 |
| 10797024 |
System-in-package with double-sided molding |
DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, YeoChan Ko |
2020-10-06 |
| 10790268 |
Semiconductor device and method of forming a 3D integrated system-in-package module |
DeokKyung Yang, HunTeak Lee |
2020-09-29 |
| 10700011 |
Semiconductor device and method of forming an integrated SIP module with embedded inductor or package |
DeokKyung Yang, WoonJae Beak, YiSu Park, OhHan Kim, HunTeak Lee |
2020-06-30 |
| 10636756 |
Semiconductor device and method of forming protrusion E-bar for 3D SIP |
DeokKyung Yang, HunTeak Lee, OhHan Kim, DaeHyeok Ha, Wanil Lee |
2020-04-28 |
| 10636774 |
Semiconductor device and method of forming a 3D integrated system-in-package module |
DeokKyung Yang, HunTeak Lee |
2020-04-28 |
| 10636765 |
System-in-package with double-sided molding |
DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, YeoChan Ko |
2020-04-28 |