Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797024 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, YeoChan Ko, HeeSoo Lee | 2020-10-06 |
| 10657400 | Method and apparatus with vein pattern authentication | Jungsoon Shin, Namjoon Kim, Joonah Park, Soochul LIM, Tae-Sung Jung | 2020-05-19 |
| 10636765 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, YeoChan Ko, HeeSoo Lee | 2020-04-28 |
| 10587789 | Image sensor simultaneously generating image and proximity signals | Du-sik Park, Joonah Park | 2020-03-10 |