Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2020-10-06 |
| 10797024 | System-in-package with double-sided molding | Yongmin Kim, Jaehyuk Choi, YeoChan Ko, HeeSoo Lee | 2020-10-06 |
| 10790268 | Semiconductor device and method of forming a 3D integrated system-in-package module | HunTeak Lee, HeeSoo Lee | 2020-09-29 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | WoonJae Beak, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2020-06-30 |
| 10636756 | Semiconductor device and method of forming protrusion E-bar for 3D SIP | HunTeak Lee, OhHan Kim, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2020-04-28 |
| 10636774 | Semiconductor device and method of forming a 3D integrated system-in-package module | HunTeak Lee, HeeSoo Lee | 2020-04-28 |
| 10636765 | System-in-package with double-sided molding | Yongmin Kim, Jaehyuk Choi, YeoChan Ko, HeeSoo Lee | 2020-04-28 |