Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804119 | Method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, HunTeak Lee, InSang Yoon | 2020-10-13 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | DeokKyung Yang, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2020-06-30 |