Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804119 | Method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, WoonJae Beak, HunTeak Lee | 2020-10-13 |
| 10804217 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, KyoungHee Park | 2020-10-13 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, Il Kwon Shim | 2020-10-06 |
| 10629565 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, OhHan Kim | 2020-04-21 |