Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804119 | Method of forming SIP module over film layer | Kyunghwan KIM, WoonJae Beak, HunTeak Lee, InSang Yoon | 2020-10-13 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2020-10-06 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, HunTeak Lee, HeeSoo Lee | 2020-06-30 |
| 10636756 | Semiconductor device and method of forming protrusion E-bar for 3D SIP | DeokKyung Yang, HunTeak Lee, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2020-04-28 |
| 10629565 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, InSang Yoon | 2020-04-21 |