Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2020-06-30 |