Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763230 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more | 2020-09-01 |
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2020-07-28 |
| 10658240 | Semiconductor die singulation | Shoichi Iriguchi, Hiroyuki Sada | 2020-05-19 |