| 10840214 |
Carrier and integrated memory |
Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Charles L. Reynolds, Thomas Weiss |
2020-11-17 |
| 10770385 |
Connected plane stiffener within integrated circuit chip carrier |
Anson J. Call, Krishna R. Tunga |
2020-09-08 |
| 10756031 |
Decoupling capacitor stiffener |
Charles L. Arvin, Franklin M. Baez, Charles L. Reynolds, Krishna R. Tunga, Thomas Weiss |
2020-08-25 |
| 10660209 |
Thin film capacitors for core and adjacent build up layers |
Charles L. Arvin, Charles L. Reynolds, Jean Audet, Francesco Preda |
2020-05-19 |
| 10622299 |
Multi terminal capacitor within input output path of semiconductor package interconnect |
Charles L. Arvin, Jean Audet, Charles L. Reynolds, Brian R. Sundlof |
2020-04-14 |
| 10607928 |
Reduction of laminate failure in integrated circuit (IC) device carrier |
Anson J. Call, Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Rui Wang |
2020-03-31 |
| 10586782 |
Lead-free solder joining of electronic structures |
Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Thomas A. Wassick, Thomas Weiss |
2020-03-10 |
| 10566275 |
Element place on laminates |
Charles L. Arvin, Brian M. Erwin |
2020-02-18 |
