Issued Patents 2020
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861850 | Fin end plug structures for advanced integrated circuit structure fabrication | Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Jeanne Luce, Michael L. Hattendorf +1 more | 2020-12-08 |
| 10854731 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane | 2020-12-01 |
| 10854732 | Dual metal gate structures for advanced integrated circuit structure fabrication | Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf | 2020-12-01 |
| 10840151 | Dual metal silicide structures for advanced integrated circuit structure fabrication | Jeffrey S. Leib, Srijit Mukherjee, Vinay BHAGWAT, Michael L. Hattendorf | 2020-11-17 |
| 10818774 | Plugs for interconnect lines for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Ilsup JIN, Angelo Kandas, Michael L. Hattendorf | 2020-10-27 |
| 10797047 | Gate isolation in non-planar transistors | Leonard P. GULER, Gopinath Bhimarasetti, Vyom Sharma, Walid M. Hafez | 2020-10-06 |
| 10796968 | Dual metal silicide structures for advanced integrated circuit structure fabrication | Jeffrey S. Leib, Srijit Mukherjee, Vinay BHAGWAT, Michael L. Hattendorf | 2020-10-06 |
| 10796951 | Etch-stop layer topography for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Ruth A. Brain, Michael L. Hattendorf | 2020-10-06 |
| 10790378 | Replacement gate structures for advanced integrated circuit structure fabrication | Byron Ho, Steven Jaloviar, Jeffrey S. Leib, Michael L. Hattendorf | 2020-09-29 |
| 10777655 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane | 2020-09-15 |
| 10775117 | Water collection/deflection arrangements | Yohann Lilian Rousselet, Dina Malamud | 2020-09-15 |
| 10777656 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Curtis W. Ward, Michael L. Hattendorf | 2020-09-15 |
| 10756204 | Fin trim isolation with single gate spacing for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf | 2020-08-25 |
| 10741669 | Differentiated voltage threshold metal gate structures for advanced integrated circuit structure fabrication | Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf | 2020-08-11 |
| 10734379 | Fin end plug structures for advanced integrated circuit structure fabrication | Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Jeanne Luce, Michael L. Hattendorf +1 more | 2020-08-04 |
| 10727313 | Dual metal gate structures for advanced integrated circuit structure fabrication | Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf | 2020-07-28 |
| 10707133 | Trench plug hardmask for advanced integrated circuit structure fabrication | Anthony St. Amour, Michael L. Hattendorf | 2020-07-07 |
| 10677543 | Cooling tower | Yohann Lilian Rousselet, Dina Malamud, Kevin Egolf, Lukasz Sztobryn | 2020-06-09 |
| 10615265 | Gate cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf | 2020-04-07 |
| 10553430 | Technologies for inverting lithographic patterns and semiconductor devices including high aspect ratio structures | Anthony St. Amour | 2020-02-04 |
| 10541316 | Contact over active gate structures for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf | 2020-01-21 |