Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861850 | Fin end plug structures for advanced integrated circuit structure fabrication | Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Michael L. Hattendorf, Christopher P. Auth +1 more | 2020-12-08 |
| 10811251 | Dielectric gap-fill material deposition | Ebony L. Mays, Aravind S. Killampalli, Jay P. Gupta | 2020-10-20 |
| 10734379 | Fin end plug structures for advanced integrated circuit structure fabrication | Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Michael L. Hattendorf, Christopher P. Auth +1 more | 2020-08-04 |
| 10693006 | Interlayer dielectric for non-planar transistors | Sameer Pradhan | 2020-06-23 |