Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Angela Kessler, Achim Strass | 2020-04-07 |