Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2020-04-07 |
| 10586756 | Chip carrier configured for delamination-free encapsulation and stable sintering | Alexander Roth, Andreas Grassmann, Juergen Hoegerl | 2020-03-10 |