Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699976 | Semiconductor module with external power sensor | Leo Aichriedler, Christian Schweikert, Gerald Wriessnegger | 2020-06-30 |
| 10679978 | Chip module with spatially limited thermally conductive mounting body | Alexander Roth, Hans-Joachim Schulze, Hans-Joerg Timme | 2020-06-09 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Wolfram Hable, Angela Kessler, Ivan Nikitin, Achim Strass | 2020-04-07 |
| 10586756 | Chip carrier configured for delamination-free encapsulation and stable sintering | Alexander Roth, Andreas Grassmann, Angela Kessler | 2020-03-10 |