Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10805015 | Method as well as test system for testing a device under test | Wolfgang Dressel, Florian Ramian | 2020-10-13 |
| 10796929 | Method for producing a metal-ceramic substrate with at least one via | — | 2020-10-06 |
| 10771076 | Measuring device, calibration method and measuring method with jitter compensation | Gregor Feldhaus | 2020-09-08 |
| 10759714 | Method for producing a metal-ceramic substrate | — | 2020-09-01 |
| 10679978 | Chip module with spatially limited thermally conductive mounting body | Juergen Hoegerl, Hans-Joachim Schulze, Hans-Joerg Timme | 2020-06-09 |
| 10586756 | Chip carrier configured for delamination-free encapsulation and stable sintering | Andreas Grassmann, Juergen Hoegerl, Angela Kessler | 2020-03-10 |